In its derivative SoCs ARMM1 to M2, Apple has integrated LPDDR memory. Now, drawing inspiration from what Apple has already done, Intel begins to insert memoria LPDDR5X within its CPUs. We start with some models of Meteor Lake processors and eventually extend the experiment to a wider range of devices.
By abandoning the x86 platform for its Mac systems, Apple designed, developed and built System-on-a-Chip which are integrated circuits containing all the major components of an electronic system or device in a single chip. Between components there are usually the CPU, memory, input/output device controllers, and other elements essential to the chip’s operation.
I Intel processorshowever, they cannot be considered SoCs: historically they include the central processing unit (CPU) and may have integrated components such as the graphics section (GPU) and the memory controller. But no more. Intel is looking more and more interested in chiplets, calling them tilebut from here to talking about SoC there is a lot.
Instead, Apple has chosen to integrate LPDDR memories into its chips to achieve greater energy efficiency e performance optimal. Furthermore, with a single SoC, it is possible to optimize the available space on the PCB.
Intel introduces a Meteor Lake processor with integrated LPDDR5X memory
Therefore, Intel’s announcement that it has decided to integrate LPDDR5X memory directly into the package of a new generation Meteor Lake processor. This is a “thick” novelty because the Santa Clara company seems oriented towards “shedding its skin” with great speed and conviction.
The product presented by Intel with LPDDR5X RAM on board is a Meteor Lake chip quad-tilewhich uses the packaging Foveros for its chiplets. In the processor package they are well placed 16GB of memory LPDDR5X-7500 made by Samsung. There bandwidth that this configuration is able to ensure can reach 120 GB/s as a peak value, a much better result than what a traditional memory subsystem based on DDR5-5200 or LPDDR5-6400 can provide.
Foveroswe remind you, is an advanced 3D packaging technology developed by Intel: the company is thus able to vertically stack different layers of chips or components allowing for greater integration and obtaining a reduction in the space occupied.
Of the advantages arising from the integration of LPDDR5X memory into the chip we have already talked about. However, it is not all roses and flowers. If a memory chip were to get damagedthe whole chip becomes automatically unusable because there is no way to fix the single failed component. Furthermore, cooling the “combined” CPU plus RAM memory requires an even more effective and efficient heat dissipation solution.
Intel had already used a DRAM in-package with its first hybrid CPU called Lakefield but it is the first time that the company seems to look at the concept of SoC with a lot of “transport”.
The opening image is taken from the Intel presentation video.